論文分享 Backend dielectric etch induced wafer arcing mechanism and

論文分享 Backend dielectric etch induced wafer arcing mechanism and

Professional Development

6 Qs

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論文分享 Backend dielectric etch induced wafer arcing mechanism and

論文分享 Backend dielectric etch induced wafer arcing mechanism and

Assessment

Quiz

Specialty

Professional Development

Medium

Created by

Calix Huang

Used 1+ times

FREE Resource

6 questions

Show all answers

1.

MULTIPLE CHOICE QUESTION

30 sec • 1 pt

Wafer arcing 通常都發生在下列哪一種tool type?

Dielectric Chamber

(RIE / MERIE)

Conductor Chamber

(TCP/ ICP)

2.

MULTIPLE CHOICE QUESTION

30 sec • 1 pt

下面哪項不是產生電漿的方式?

電磁耦合電漿

(Magnetic Couple Plasma)

變壓耦合電漿

(Transformer Couple Plasma)

感應耦合電漿

(Inductively Couple Plasma)

電容耦合電漿

(Capacitively Coupled Plasma)

3.

MULTIPLE CHOICE QUESTION

30 sec • 1 pt

下面哪一種Type 不是Wafer 表面arcing 的特徵?

蛇狀

蟲狀

焦黑痕跡

凹陷

4.

MULTIPLE CHOICE QUESTION

30 sec • 1 pt

本文的介紹中產生Arcing 的type 有幾個?

1

2

3

5.

MULTIPLE CHOICE QUESTION

30 sec • 1 pt

下列哪一種type 不是產生arcing defect 的機制?

由wafer 晶邊的敏感結構使金屬層易裸露

局部的瞬態不穩定電漿而引起arcing

局部高溫引發arcing

6.

MULTIPLE CHOICE QUESTION

30 sec • 1 pt

導致wafer 表面arcing 的關鍵因素有哪些?

Chamber design

Operator parameter

(Recipe setting)

Wafer surface patterning

Film structure

以上皆是