IC FABRICATION

ICs are generally made of

• Silicon

• Germanium

• Copper

• Aluminium

The most commonly used ICs are

• Thin films

• Monolithic

• Hybrid

• Thick films

Which of the following cannot be fabricated on an IC

• Transistors

• Diodes

• Resistors

• Large inductors and transformers

The active components in an IC are

• Resistors

• Capacitors

• Transistors and diodes

• Inductor

Which of the following is most difficult to fabricate in an IC?

• Diode

• Transistor

• FET

• Capacitor

Oxidation is used for:

• Isolation

• Interconnection

• Doping

• Packaging

Metallization is used for:

• Interconnection

• Protection

• Packaging

• doping

Etching is used for:

• Selective removal of the unwanted surface

• Cleaning

• Interconnection

• Protection

Which method is most suitable for silicon crystal growth in silicon wafer preparation?

• Float zone process

• Bridgeman-Stockbarger method

• Czochralski crystal growth process

• Laser heated pedestal growth

Optical masking is used for

• Pattern transfer

• Protection

• Cleaning

• Covering