Pre & Post Course Quiz MQC Back End

What is the main purpose of IC packaging?

• Increase die size

• Reduce power consumption

• Protect the silicon die and allow electrical connections

• Improve wafer yield

Which of the following is the final step in IC assembly?

• Die attach

• Wire bonding

• Final test and inspection

• Molding

Which process uses epoxy or solder to attach the die to the substrate?

• Wire bonding

• Die attach

• Molding

• Trim & Form

Why is quality control critical in semiconductor back-end processes?

• To avoid design flaws

• To reduce software bugs

• To prevent failures in critical systems like medical and automotive

• To improve CPU speed

What does COPQ stand for in quality control?

• Control Over Process Quality

• Cost of Process Quality

• Cost of Poor Quality

• Control of Product Quality

Which QC method is commonly used to check for voids under the die in die attach?

• Pull test

• X-ray inspection

• Shear test

• Check sheet

What defect in wire bonding can be caused by poor ultrasonic settings or contamination?

• Mold flash

• Bond lift

• Die tilt

• Burrs

Which defect is commonly associated with the molding process?

• Heel crack

• Bond shift

• Mold flash

• Die crack

Which of the following tools is used to verify wire bond strength?

• Profile gauge

• Pull tester

• Vision camera

• X-ray

In trim & form QC, bent or uneven leads can be inspected using:

• Die shear tester

• Pull tester

• Profile gauge

• Burn-in chamber