CEB1124

CEB1124

University

30 Qs

quiz-placeholder

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CEB1124

CEB1124

Assessment

Quiz

Instructional Technology

University

Easy

Created by

MOHAMMAD AZIB BIN KHAIRUDIN KPM-Guru

Used 1+ times

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30 questions

Show all answers

1.

OPEN ENDED QUESTION

3 mins • 1 pt

Apakah tujuan kertas penerangan ini?

Evaluate responses using AI:

OFF

2.

OPEN ENDED QUESTION

3 mins • 1 pt

Apakah prosedur pemisahan bahagian elektronik rosak?

Evaluate responses using AI:

OFF

3.

OPEN ENDED QUESTION

3 mins • 1 pt

Apakah kaedah jalinan untuk penyediaan pad pelekap permukaan?

Evaluate responses using AI:

OFF

4.

OPEN ENDED QUESTION

3 mins • 1 pt

Apakah penting untuk mengelakkan meletakkan tekanan ke bawah atau sisi pad pada keringan apabila menggunakan haba?

Evaluate responses using AI:

OFF

5.

OPEN ENDED QUESTION

3 mins • 1 pt

Apakah kaedah peranti vakum desolder yang digunakan untuk penyediaan pad pelekap permukaan?

Evaluate responses using AI:

OFF

6.

OPEN ENDED QUESTION

3 mins • 1 pt

Apakah prosedur yang termasuk dalam soldering surface mount chip components, point-to-point method?

Evaluate responses using AI:

OFF

7.

OPEN ENDED QUESTION

3 mins • 1 pt

Apakah prosedur untuk menukar komponen pada papan litar tercetak?

Evaluate responses using AI:

OFF

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