OSAT FOL & EOL

Who is the market leader in OSAT business ?

• ASE Group

• Chipmos

• TongFu Microelectronics

• Powertech

The most frequently used semiconductor material is ?

• Silicon

• germanium

• gallium

• Aluminium 

The purpose of back grinding is to_________

• Minimize thickness 

• Improve aesthetics

• Increase strength 

• Reduce diameter

Pick the maximum size of standard wafer _______

• 300 mm

• 650 mm

• 450 mm

• 200 mm

Identify the connection type _____

• Wire bond 

• Clip Bond 

• Wedge bonding 

• Flip Chip 

The term Die refers _______

• Mold 

• Chip 

• Connecting pins 

• Bonding material 

What would be the minimum clean room requirement for OSAT FOL ?

• 100K

• 1K

• 10 K

• None

The process by which die are separated from a wafer of semiconductor is  ?

• Wafer Grinding 

• Tape attaching 

• Wafer Dicing 

• Curing 

Identify the connection type _________

• Wire bond 

• Clip Bond 

• Wedge bonding 

• Flip Chip 

The most preffered bonding material used in wire bonding is______

• Aluminium

• Gold 

• Copper 

• Silver