IC assembly part 1

What is Moore's law?

• The number of transistors in IC doube every year

• The number of transistors in IC doube every 2 year

• The number of transistors in IC doube every 3 year

• The number of transistors in IC doube every 6 month

What is the smallest fab process technology in 2023?

• 1nm

• 2nm

• 3nm

• 4nm

What is SIP assembly?

• Silicon in plastic

• Silicon in PCB

• System in plastic

• System in package

What is net surface area advanatageous of 8 inches vs 2 inches wafer?

• 13

• 15

• 17

• 19

Which one is not a P-donor for Si?

• B

• Ga

• In

• Sb

Which one is not N-type donor for Si?

• P

• As

• Sb

• Al

What is the risk of using wafer map probe files as compared to inked die?

• Incorrect mapping in the probe files.

• Wrong pass fail translation by the program

• missing file

• Operator incorrectly load the probing program

Why wafer is in circle shape?

• easy to handle

• because equipment is designed based on circle shape

• circle shape quarantee process consistency

• physical property of Si ingot

What is edge die?

• dead die

• cracked die

• die that failed the probe test

• die at the furthest boundary of the wafer

Mark 2 biggest components in an IC.

• lead frame

• die

• mold compound

• bond wires