IC PACKAGING

IC PACKAGING

University

15 Qs

quiz-placeholder

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IC PACKAGING

IC PACKAGING

Assessment

Quiz

Other

University

Practice Problem

Hard

Created by

marife rosales

Used 5+ times

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15 questions

Show all answers

1.

MULTIPLE CHOICE QUESTION

30 sec • 1 pt

In electronics manufacturing, is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encapsulated in a supporting case that prevents physical damage and corrosion

Packaging

Testing

Decapsulation

2.

MULTIPLE CHOICE QUESTION

30 sec • 1 pt

Other names for packaging include ______

semiconductor device assembly

encapsulation

sealing

all answers are correct

3.

MULTIPLE CHOICE QUESTION

30 sec • 1 pt

____ is the mounting and interconnecting of integrated circuits (and other components) onto printed-circuit boards.

Electronic Packaging

Integrated Circuit Packaging

Both answers are correct

Both answers are wrong

4.

MULTIPLE CHOICE QUESTION

30 sec • 1 pt

This type of package houses a small semiconducting die, with nanowires attaching the die to the lead frames, allowing for electrical connections to be made to a PCB.

SIP

DIP

BGA

5.

MULTIPLE CHOICE QUESTION

30 sec • 1 pt

Meaning of JEDEC

Joint Electron Device Engineering Council

Joint Electronics Device Engineering Council

Joint Electronics Device Engineering Corporation

6.

MULTIPLE CHOICE QUESTION

30 sec • 1 pt

_____ is a family of semiconductor packages defined by JEDEC. This family comprises lead-mounted axial devices with round leads

DO 204

TO 204

Both are correct

Both are wrong

7.

MULTIPLE CHOICE QUESTION

30 sec • 1 pt

______ is a designation for a group of semiconductor packages for surface mounted diodes.

Small Outlier Diode

Surface Outline Diode

Small Outline Diode

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